The analysis of 2D measurement methods and means is presented. The actual optical-electronic devices using bar codes are discussed. The correlation functions of measuring and reference codes in the electronic level instrument are calculated showing possible errors in height determination. The new electronic level design is proposed simplifying the main design and as well as the meter of the level. The principal correlation and error determination equations are given, and the diagrams of the new design are included.

In order to reduce and control yield loss in the fabrication process of next generation ULSI devices, nano-defects inspection technique for polished Silicon (Si) wafer surface becomes more essential. This paper discusses the new optical nano-defects detection method, which is applicable to the silicon wafer surface inspection technique for next-generation semiconductors.
In our proposed method, the evanescent light is emerged on the wafer surface with total internal reflection (TIR) of infrared (IR) laser at the Si-air interface. And by scanning the surface where is evanescent light emerging with very shaped fibre probe, it enables to detect nanometre scale defects in the vicinity of Si wafer surface without diffraction limit to resolution. To verify the feasibility of this method, both of the computer simulations based on Maxwell’s equations and the several fundamental experiments are performed. FDTD simulation shows that the proposed method is effective to detect nano-defects existing not only on Si surface but also in the subsurface with high sensitivity. And also the fundamental experiments show the validity of this method by demonstrating nano-defects detections of subsurface as well as surface.

The paper presents a method that is an attempt to solve the problem of non-linear approximation of geometrical elements according to Chebyshev norm. On the base of general two step algorithm it performs an evaluation of minimal deviation from maximal values of measured shapes driving to the optimal solution on the iterative way. The proposed method implemented for some geometric features has been verified for a many samples of simulated and measured datapoints.

An optical system based on fringe projection method has been developed for the measurement of the cross-section area of formed sheet metal, which is generally susceptible of being reduced, and sometimes leads to necking and tearing during forming process. A better understanding of the material and component behaviour is a challenge to experimental measuring methods. To realise such a method the part to be measured is digitised in different orientations by a fringe projection system. With the help of a newly developed inspection technique, the estimation of wall thickness in the critical zones of formed sheet metal part will be implemented by evaluating the measured data, taken in different orientations from the fringe projection system, and the result would be displayed for visualisation. This method allows fast, objective and non-destructive inspection of formed metal sheet and the detection of its defects. This measurement system can be integrated in automated operating procedure for 100% inspection and also enables the speeding up of mass production. This work presents an evaluation strategy and first measuring results.

We have started developing novel systems and key technology as “Nano-CMM project”. In this project, our intention is developing the CMM with nano meter resolution to measure three-dimensional positions, orientations and parameters of three-dimensional features. For developing Nano-CMM, we evaluate properties of stages for Nano-CMM by thermal drift and tilt angles. In this report, the thermal drift and tilt angles of stages of Nano-CMM were evaluated. Then we made the new prototype of Nano-CMM made of low thermal expansion iron steel to reduce the influence of thermal drift and we also propose new construction of Nano-CMM for reducing the effect by tilt angles.